一、Overview实物图
二、Features特色
极速AI一键编程，快速测试
RapidAIoneclickprogrammingandquicktesting
全球首款智能人机交互（语音识别）AOI
Theworld'sfirstintelligentHuman-ComputerInteraction(voicerecognition)
行业误报最少检测设备之一
Oneoftheindustry'slowestfalsealarmdetectiondevices
三、Precision optical imaging精密的光学影像
工业相机高速取像，抓拍高清
Industrialcameraforhigh-speed imagingandcapturing high-definitionphotos.
三色塔型光源RGB三色LED与多角度塔状组合设计，能准确反映出物体表面坡度层次信息
Tri-colortower-shapedlightsource:RGBtri-color LEDscombinedwithamulti-angletowerdesign,accuratelyreflectingthesurfacegradient informationofobjects.
双远心镜头：拍摄图象无视差，有效避免反光干扰，最大程度降低高元件，解决景深问题
TelecentricLens:Capturesimageswithoutparallax,effectivelyavoidsglareinterference,minimizes theimpactofhighcomponents,andresolvesdepthoffieldissues.
四、实例
四、Datasheet规格表
型号Model T3 pro | |
轨道与PCB尺寸Conveyor&PCB Size | |
PCB尺寸Dimension | 0x50mm-470x330mm |
PCB厚度Thickness | 0.5mm -5mm |
PCB元件高度Height | Top 25mm:Bottom 110mm |
PCB翘曲高度Warp | ±3mm |
工艺边PCB Transfer Height | 2.5mm |
光学参数Optical Parameter | |
摄像头Camera Spec | 5MP |
分辨率Resolution | 15μm |
光学镜头Optical Lens | 双远心光学镜头Telecentric Optical Lens |
光源Light-Source | 多光谱超高速RGB六通道光源Multis pectral Super speed RGB Light Source |
速度Speed | 0.238 sec/FOV |
硬件配置Hardware | |
X/Y平台重复定位精度Table Positioning Accuracy | +/-0.01mm |
X/Y平台移动速度Table Speed | 900mm/s |
PCB夹持PCB Clambing | 自动夹持By Auto |
驱动Driver | 松下交流伺服电机+研磨丝杆AC Servo Motor+Screwing Shaft |
设备外观尺寸Dimension(W*D*H) | 860X 1040X 1318mm |
重量Weight(KG) | 345KG |
电源及功率Power Supply | AC 220V 50/60Hz 1KW |
操作系统Operating System | Win 10企业版Enterprise Edition |
显示器Display | 23.8”LCD Monitor |
独立显卡Discrete graphics | 英伟达NVIDIA 3060 |
可检测类型Inspection Category | |
元件检查Component Inspection | 缺件，反转，偏移，极性，错件，破损，AI元件弯脚，PCB板异物，金手指 沾锡，溢胶，整板侦测多件。 Missing,Rolling,Shifting,Polarity Error,Wrong Part,Damaged, Bended,PCB Abnormal,Residua,Glue Overflow |
焊接检查Solder Inspection | 锡多锡少，侧立，立碑，锡桥，虚焊，翘脚，锡珠，波峰焊后焊接(含插件) Excess Solder,Insufficient Solder,Bridging,Lifting,Solder Balls,Soldering Abnormal |
特殊检测项目Special Inspection Items | 可检查锡膏制程，红胶制程及波峰焊后的PCB上元件的装配焊接质量，3D可 测元件高度，引脚翘起虚焊，做高度检测 Can Check Solder Paste and Epoxy Glue Process,Soldering Quality; Checking Floating Components and Cold Joint by 3D |
软件系统Software | |
检测算法Inspection Method | AI算法、特征矢量分析法、丝印OCV算法 AI Algorithm&The Eigenvector Analysis &OCV Silkscreen Algorithm |
多角度检测Inspection Angle Area | 0-360°,检测精度Accuracy=1° |
标记功能Marking Function | PCB整板Mark,拼板Mark,坏板Mark等 One Board Marking &Multi-pieces Board Marking &Bad Marking,etc. |
编程模式Programming Mode | 1.CAD坐标自动导入CAD Coordinate Loading 2. 自动索引元件库Component Database Auto-index 3.软件自动AI建模Auto-programming by Intelligent Software |
远程控制Remote Control | 通过网络实现：离线编程；远程实时调试；远程查看/远程控制操作设备等 Network Monitoring:Offline Debugging,Online Monitoring & Manipulating,Remote Realized Examing |
人机交互系统Human-Computer Interaction system | 通过语音指令控制软件操作机器，解放双手提升效率 Improve efficiency and free up hands by controlling software operations on machines through voice commands |
记录功能Data Recording | 自动生成统计分析(SPC)及数据报表 Auto-generated Statistical Process Controlling Data(SPC)&Report |
选项Option | |
